Mari Papel y Corrugado

Mari Papel y Corrugado

Mari Papel y Corrugado (ISSN 1794-3396) is a peer-reviewed academic journal dedicated to publishing innovative research and comprehensive review articles in the fields of Industrial Engineering, Manufacturing Engineering, Materials Science, and Computer Engineering. Founded in 1988, the journal initially catered to Spanish-speaking audiences. In 2019, we adopted English as the primary language of publication to enhance our global reach and accessibility. While historically publishing a limited number of papers, Mari Papel y Corrugado is now committed to significantly increasing its publication frequency and welcoming high-quality contributions from researchers worldwide. Authors are encouraged to submit their work for peer-review and potential inclusion in our journal.

Editor in Chief

Prof. João Paulo Davim

Prof. João Paulo Davim

University of Aveiro, Portugal

Recently Published Articles

Zainab N. Mutashar1, Sura N. Taraad2
1Department of Physics, Thi-Qar Directorate of Education, Ministry of Education, Thi-Qar, Iraq
2Department of Physics Diwaniyah Directorate of Education, Ministry of Education, Diwaniyah, Iraq
Yan Zhang1
1Department of Information Engineering, Shijiazhuang University of Applied Technology, ShiJiaZhuang 050000, China
Maneesh Yadav1, Gurudev Sahil2, Dhriti Dhaundiyal3, Shruti Dhaundiyal4
1College of Law & Legal Studies, Teerthanker Mahaveer University, Moradabad (India)
2SLS Hyderabad Symbiosis International (Deemed University), Pune (India)
3School of Design, Doon University, Dehradun (India)
4Independent Researcher (India)
Wu Zhiwu1, Huang Tianfu1, Wang Chunguang1, Wu Xiang1, Tu Yanzhao1
1State Grid Fujian Electric Power Co., Ltd. Marketing Service Center, Fuzhou 350013, Fujian, China
Chengyao Li1, Yingshun Yu1, Zhongchao Hu1
1School of Automotive Engineering, Foshan Polytechnic, Foshan 528137, China
Cuiying Fu1
1School of Municipal Engineering, Shanghai Construction Management Vocational College, Shanghai 201702, China
Akibu Mahmoud Abdullahi1, Isyaku Hassan2, Md Shakil Hossain3, Yusuf Abubakar3
1School of Computing and Information Technology, Taylor’s University, 47500 Subang Jaya, Selangor, Malaysia
2Faculty of Languages and Communication, Universiti Sultan Zainal Abidin, Terengganu, Malaysia
3School of Computing and Informatics, Albukhary International University, Alor Setar, Malaysia
Hao Huang1, Biao Shen2, Wei Zhang2, Ge Pan2
1Nanjing Suyi Industry Co., Jiangsu Xinshun Energy Industry Group Co., Ltd: No. 22, West Beijing Road, Nanjing, China
2Nanjing Huaqun Energy Group Co., Ltd, No. 251 Zhongshan Road, Gulou District, Nanjing, China

Enhanced possibilities for publishing your research

For editors

Ensure fair and ethical review of all submitted work, maintaining high standards throughout the review process. Strive to provide clear and timely feedback to authors while upholding the journal’s integrity.

For authors

Submit original, well-researched, and clearly written manuscripts, adhering to all publication standards and ethical guidelines. Ensure that your work contributes significantly to the field and follows our formatting requirements.

For reviewers

Provide unbiased and constructive feedback, helping to maintain the journal’s quality and integrity. Offer detailed critiques and suggestions to authors, ensuring that the review process is thorough and fair.

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